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Thick macroporous membranes made of p‐type silicon
Author(s) -
Zheng J.,
Christophersen M.,
Bergstrom P. L.
Publication year - 2005
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200461113
Subject(s) - membrane , wafer , silicon , etching (microfabrication) , materials science , porous silicon , chemical engineering , macro , porosity , nanotechnology , composite material , chemistry , optoelectronics , computer science , engineering , layer (electronics) , biochemistry , programming language
In the last decade, very thick macro porous silicon (PS) has been enjoying a growing popularity in a wide range of applications. There is also an increasing demand for thick macroporous membranes with through pores. In this work, we studied the optimal etch conditions with respect to stable pore growth and high etch rate for macro PS in p‐type silicon. A single‐step etching process has been developed to tackle the problem of uniform membrane formation. Very thick (>500 µm) through‐wafer macroporous membranes on p‐type silicon with variable pore sizes and growth rates up to 0.95 µm/min have been successfully demonstrated. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)