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Quantification of physical (roughness) and chemical (dielectric constant) leaf surface properties relevant to wettability and adhesion
Author(s) -
Nairn Justin J,
Forster W Alison,
van Leeuwen Rebecca M
Publication year - 2011
Publication title -
pest management science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.296
H-Index - 125
eISSN - 1526-4998
pISSN - 1526-498X
DOI - 10.1002/ps.2213
Subject(s) - wetting , contact angle , adhesion , dielectric , materials science , surface roughness , fractal dimension , surface tension , composite material , surface finish , fractal , thermodynamics , mathematics , mathematical analysis , physics , optoelectronics
BACKGROUND: Spray droplet adhesion is dependent not only on formulation and droplet parameters but also on the surface properties (physical and chemical) of the leaf. Quantifying these leaf surface properties would aid understanding and modelling of adhesion, helping to optimise spray formulations. Fractal dimensions (FDs) were used to quantify the relative leaf surface roughness of ten plant species. Static droplet contact angles were measured on each leaf surface, and wetting tension was calculated. Chemical profiles of the leaf surfaces were developed by evaluating contact angle behaviour relative to solution dielectric constants. RESULTS: The FDs of Cryo‐SEM micrographs taken at 300× magnification gave the best correlation with adhesion. The wetting tension intercept had a strong relationship with mean adhesion, and successfully accounted for the wettability of the outlier species. CONCLUSIONS: The microroughness of the leaf surface, as revealed by Cryo‐SEM, can be quantified by fractal dimension analysis. However, the wetting tension intercept is a more useful universal measure of the surface properties of the leaf (including roughness) as they pertain to adhesion. The slope of the wetting tension versus dielectric constant plot allowed preliminary quantification of the chemical contribution of leaf surface dielectric behaviour to adhesion. Copyright © 2011 Society of Chemical Industry