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Characteristics of fire and explosion in semiconductor fabrication processes
Author(s) -
Chen Jenq Renn
Publication year - 2002
Publication title -
process safety progress
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.378
H-Index - 40
eISSN - 1547-5913
pISSN - 1066-8527
DOI - 10.1002/prs.680210106
Subject(s) - flammable liquid , fabrication , semiconductor , semiconductor device fabrication , process (computing) , process safety , forensic engineering , materials science , engineering , process engineering , waste management , nanotechnology , chemical plant , computer science , chemical engineering , optoelectronics , medicine , alternative medicine , pathology , wafer , operating system
Abstract The characteristics of fire and explosion in semiconductor fabrication processes differ from those in the chemical process industries. Case studies are given to illustrate the common, as well as peculiar features of fire and explosion in the fabrication processes. In particular, the process exhaust systems, usually involving flammable, pyrophoric and corrosive gases and vapors, were shown to be a major fire and explosion source. With some preliminary understanding of the semiconductor process, standard chemical process safety knowledge can be readily applied to semiconductor processes.