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Numerical Simulation of HTPB Resin Curing Process Using OpenFOAM and Study the Effect of Different Conditions on its Curing Time
Author(s) -
Moghimi Rad Hamed,
Tavangar Roosta Saeed,
Motamed Shariati Seyed Hadi,
Ghorban Hosseini Seyed
Publication year - 2021
Publication title -
propellants, explosives, pyrotechnics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.56
H-Index - 65
eISSN - 1521-4087
pISSN - 0721-3115
DOI - 10.1002/prep.202000321
Subject(s) - curing (chemistry) , solver , materials science , composite material , finite volume method , mold , computer science , mathematics , mechanics , mathematical optimization , physics
The main purpose of this study is to optimize the curing time of HTPB, by analyzing the curing process in different conditions. Solving equations have been performed using OpenFOAM software and according to the finite volume method. To solve the curing equation, a new solver called CureFOAM was developed and added to the OpenFOAM. Using the experimental results available in the sources, the developed solver was validated. The maximum relative error is +5 %. After validating the CureFOAM solver, the effect of various factors affecting the curing process was simulated. Based on the results, an increase of 10 °C temperature reduces curing time to 2 days, and the use of a fan oven in the Reynolds 1500 range, reduces curing time by up to 50 percent. Also, the curing process in the mold of a rectangular cube is done faster than the cylindrical and spherical molds, in different aspect ratios.