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Effects of Different Additives on Energy Release of SF‐3 Double‐Based Propellant System Containing (Mg(BH x ) y )
Author(s) -
Liu Xiaohan,
Wei Xiaoan,
Du Ping,
Wang Zeshan
Publication year - 2021
Publication title -
propellants, explosives, pyrotechnics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.56
H-Index - 65
eISSN - 1521-4087
pISSN - 0721-3115
DOI - 10.1002/prep.202000303
Subject(s) - thermal decomposition , activation energy , propellant , calorimeter (particle physics) , decomposition , analytical chemistry (journal) , base (topology) , copper , materials science , order of reaction , oxide , copper oxide , boron oxide , chemistry , reaction rate constant , kinetics , metallurgy , organic chemistry , mathematical analysis , physics , mathematics , quantum mechanics , detector , electrical engineering , engineering
In order to study the effects of different additives on the energy release of an SF‐3 double‐base propellant system comprising a boron‐containing hydrogen‐storage‐alloy (Mg(BH x ) y ), curves of heat generation versus the temperature and curves of adiabatic decomposition temperature versus the time, of this system with copper oxide (CuO) or nanometer copper oxide (nano‐CuO) as the additive were obtained by a scanning calorimeter (Scanning) and a fast ‐adiabatic accelerating rate calorimeter (Fast‐ARC), respectively. Kinetic parameters, such as the apparent activation energy, the pre‐exponential factor, and the reaction order were calculated. The effects of these two additives on the thermal decomposition of the SF‐3 double‐base propellant system containing Mg(BH x ) y were investigated. The results show that CuO used in an amount within a certain range (1∼2.5 % based on the SF‐3 content) can promote the thermal decomposition reaction. When the amount of nano‐CuO added exceeds a certain value (about 2 % based on the SF‐3 content, the thermal decomposition reaction will be significantly slowed down, and the hindrance to the reaction will not be obviously changed after more nano‐CuO is added.