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Porous Films: Size Control of Porous Silicon Nanoparticles by Electrochemical Perforation Etching (Part. Part. Syst. Charact. 2/2014)
Author(s) -
Qin Zhengtao,
Joo Jinmyoung,
Gu Luo,
Sailor Michael J.
Publication year - 2014
Publication title -
particle and particle systems characterization
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.877
H-Index - 56
eISSN - 1521-4117
pISSN - 0934-0866
DOI - 10.1002/ppsc.201470007
Subject(s) - porous silicon , materials science , porosity , etching (microfabrication) , perforation , nanoparticle , silicon , layer (electronics) , nanotechnology , composite material , electrochemistry , ultrasonic sensor , porous medium , chemical engineering , optoelectronics , electrode , chemistry , acoustics , engineering , punching , physics
Size‐controlled porous silicon nanoparticles are prepared by pulsed electrochemical etching, followed by ultrasonic fracture of the freestanding porous layer. As described by Michael J. Sailor and co‐workers on page 252, ultrasonic fracture selectively cleaves the porous film along the high‐porosity perforations, providing selective improved size control and yields of the porous silicon nanoparticles without any complicated post‐ or preprocessing steps.