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Humidification effect of air plasma effluent gas on suppressing conidium germination of a plant pathogenic fungus in the liquid phase
Author(s) -
Shimada Keisuke,
Takashima Keisuke,
Kimura Yutaka,
Nihei Kenji,
Konishi Hideaki,
Kaneko Toshiro
Publication year - 2020
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201900004
Subject(s) - effluent , germination , plasma , chemistry , conidium , hydrogen , gas phase , chemical engineering , environmental chemistry , environmental engineering , botany , organic chemistry , environmental science , biology , physics , quantum mechanics , engineering
Increase of the water flow rate into atmospheric pressure air discharge plasma for humidification can significantly improve suppressing conidium germination of a plant pathogenic fungus in the liquid phase by its effluent gas exposure. The role of the introduced water includes enhancement of hydrogen supply to the plasma and cooling of the plasma effluent gas. The hydrogen‐containing precursors for antibacterial species generation are experimentally increased. The gas cooling by the latent heat assists dinitrogen pentoxide density in the gas phase, a suggested precursor for antibacterial species generation near the liquid surface. This suggested near‐surface reaction is a second‐order reaction, generally requiring lower precursors concentrations and leading to less residues, thus it can be an important process for agricultural applications.