Cover Picture: Plasma Process. Polym. 7∕2018 | Zendy

Kim Sung Hyun | Zendy; Kim Mac | Zendy; Lee Jae Heung | Zendy; Lee SangJin | Zendy

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Cover Picture: Plasma Process. Polym. 7∕2018

Author(s) -

Kim Sung Hyun,

Kim Mac,

Lee Jae Heung,

Lee SangJin

Publication year - 2018

Publication title -

plasma processes and polymers

Language(s) - English

Resource type - Reports

SCImago Journal Rank - 0.644

H-Index - 74

eISSN - 1612-8869

pISSN - 1612-8850

DOI - 10.1002/ppap.201870017

Subject(s) - materials science , sputtering , layer (electronics) , composite material , plasma , polymer , barrier layer , cover (algebra) , moisture , thin film , optoelectronics , nanotechnology , mechanical engineering , physics , quantum mechanics , engineering

Back Cover: Novel moisture barrier films are fabricated via continuous roll‐to‐roll sputtering. Especially, plasma polymer fluorocarbon thin film for organic layer fabricated using CNT/PTFE composite target by mid‐frequency sputtering. The organic layer in the 2‐dyad structure heals the defects of its inorganic layer and shows good moisture barrier properties with SiN x or SiO 2 layer. This barrier film also exhibits high flexibility and water repellency. Further details can be found in the article by S.‐J. Lee et al. ( e201700221 ).

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