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Back Cover: Plasma Process. Polym. 8∕2017
Author(s) -
Lafuente Marta,
Martínez Elena,
Pellejero Ismael,
Carmen Artal María,
Pilar Pina María
Publication year - 2017
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201770015
Subject(s) - materials science , plasma , photolithography , plasma etching , annealing (glass) , surface roughness , cover (algebra) , microstructure , plasma chemistry , nanotechnology , isotropic etching , chemical engineering , etching (microfabrication) , composite material , mechanical engineering , engineering , physics , layer (electronics) , quantum mechanics
Back Cover: We have fabricated hierarchical structured PP surfaces with durable SCA above 140° by using a simple microstructuration process based on a standard photolithography further oxygen plasma etching. The O 2 ions selectively attack non‐protected PP, resulting well‐defined microstructures with surface roughness in the nanometric range. Hence, after plasma, thermal annealing at 100°C is performed to provoke a chemical surface restructuring process that leads to a new energetically favourable hydrophobic state. Further details can be found in the article by M. Lafuente et al. on 1700019 .
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