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Modeling of Thermal Plasma Processes: The Importance of Two‐Way Plasma‐Surface Interactions
Author(s) -
Murphy Anthony B.,
Park Hunkwan
Publication year - 2017
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201600177
Subject(s) - plasma , vaporization , materials science , plasma window , dense plasma focus , plasma cleaning , plasma etching , plasma processing , plasma arc welding , atomic physics , welding , composite material , etching (microfabrication) , thermodynamics , physics , nuclear physics , layer (electronics)
Most thermal plasma applications involve interactions between the plasma and solid or liquid surfaces. Computational models of thermal plasma applications typically consider the influence of the plasma on the surface, but often neglect the effect of the surface on the plasma. In many cases, however, it is not possible to accurately model the plasma process without taking the two‐way interactions into account. This is demonstrated using examples from arc welding, plasma cutting, plasma‐particle interactions, such as occur in plasma spheroidization, plasma nanoparticle production and plasma spraying, and high‐ and low‐voltage circuit breakers. Vaporization of metal, ceramic and polymer surfaces, transfer of heat and momentum from the plasma to particles and droplets, and changes in the surface shape are all shown to affect the properties of the plasma.