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Optimizing Humic Acid Removal by Modifying the Surface Chemistry of Plasma Polymerized Allylamine Coated Particles
Author(s) -
Jarvis Karyn L.,
Majewski Peter
Publication year - 2016
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201500205
Subject(s) - humic acid , allylamine , polymerization , plasma polymerization , chemistry , polymer chemistry , chemical engineering , polymer , organic chemistry , polyelectrolyte , fertilizer , engineering
Plasma polymerized allylamine films were deposited onto quartz particles at low pressure to optimize humic acid removal by varying the plasma power, flow rate, and polymerization times. Increasing the plasma power increased the number of positively charged groups and humic acid removal. Increasing the allylamine flow rate increased the number of positively charged groups but maximum humic acid removal was observed at 6.48 sccm due to humic acid removal by positively charged and uncharged crosslinked species. Longer polymerization times increased the number of positively charged groups while similar humic acid removal resulted as the larger humic acid molecule cannot penetrate as readily into the film as the acid orange 7 used to determine the number of positively charged groups. Manipulation of the plasma parameters has shown to provide significant control over humic acid removal.