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Sulfur‐Rich Organic Films Deposited by Plasma‐ and Vacuum‐Ultraviolet (VUV) Photo‐Polymerization
Author(s) -
Kasparek Evelyne,
Tavares Jason R.,
Wertheimer Michael R.,
GirardLauriault PierreLuc
Publication year - 2016
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201500200
Subject(s) - x ray photoelectron spectroscopy , plasma enhanced chemical vapor deposition , sulfur , plasma polymerization , polymerization , chemical vapor deposition , ultraviolet , fourier transform infrared spectroscopy , hydrogen sulfide , chemistry , analytical chemistry (journal) , thin film , hydrogen , materials science , polymer , chemical engineering , organic chemistry , nanotechnology , optoelectronics , engineering
Thiol (SH)‐terminated surfaces have been progressively gaining interest over the past years as a consequence of their widespread potential applications. Here, SH‐terminated thin films have been prepared by “co‐polymerizing” gas mixtures comprising ethylene (C 2 H 4 ) or butadiene (C 4 H 6 ) with hydrogen sulfide (H 2 S). This has been accomplished by either vacuum‐ultraviolet (VUV) irradiation of the flowing gas mixtures with near‐monochromatic radiation from a Kr lamp, or by low‐pressure r.f. plasma‐enhanced chemical vapor deposition (PECVD). Varying the gas mixture ratio, R , allows one to control the films’ sulfur content as well as the thiol concentration [SH]. The deposits were characterized by X‐ray photoelectron spectroscopy (XPS), before and after chemical derivatization with N ‐ethylmaleimide, and by ATR FTIR. VUV‐ and plasma‐prepared coatings were found to possess very similar structures and characteristics, showing chemically bonded sulfur concentrations, [S], up to 48 at% and [SH] up to 3%. All coatings remained essentially unchanged in thickness after immersion in water for 24 h.