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Effects of Ar and O 2 Plasma Etching on Parylene C: Topography versus Surface Chemistry and the Impact on Cell Viability
Author(s) -
Kontziampasis Dimitrios,
Trantidou Tatiana,
Regoutz Anna,
Humphrey Eleanor J.,
Carta Daniela,
Terracciano Cesare M.,
Prodromakis Themistoklis
Publication year - 2016
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201500053
Subject(s) - x ray photoelectron spectroscopy , parylene , etching (microfabrication) , plasma , argon , chemistry , analytical chemistry (journal) , plasma etching , polymer , plasma chemistry , atomic force microscopy , inert , contact angle , materials science , nanotechnology , chemical engineering , composite material , organic chemistry , physics , layer (electronics) , quantum mechanics , engineering
The effect of O 2 and Ar plasma etching on poly(chloro‐p‐xylylene) (Parylene C) is thoroughly studied by atomic force microscopy, X‐ray photoelectron spectroscopy, and static contact angle measurements. Results indicate that O 2 plasma changes the topography more drastically than Ar plasma. Furthermore, despite the fact that Ar plasma is expected to be chemically inert, both plasmas introduce O 2 to the surface of the Parylene C films, while Ar plasma additionally reduces the amount of Cl present in the polymer. The effect on the viability of cultured cardiomyocytes is also examined, indicating that cells attach and survive both on Ar and O 2 treated films in contrast to untreated Parylene. These observations can provide useful insight into the field of material science and tissue engineering.