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Cover Picture: Plasma Process. Polym. 6∕2014
Author(s) -
Alvarez Rafael,
GarciaMartin Jose M.,
LopezSantos Maria C.,
Rico Victor,
Ferrer Francisco J.,
Cotrino Jose,
GonzalezElipe Agustin R.,
Palmero Alberto
Publication year - 2014
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201470022
Subject(s) - front cover , cover (algebra) , plasma , sputter deposition , materials science , oblique case , thin film , sputtering , deposition (geology) , porosity , simple (philosophy) , cavity magnetron , front (military) , atomic physics , geometry , nanotechnology , composite material , physics , mechanical engineering , nuclear physics , engineering , mathematics , geology , meteorology , paleontology , linguistics , philosophy , sediment , epistemology
Front Cover: The deposition rate of porous thin films deposited by magnetron sputtering at oblique angles is described assuming two contributions: the incorporation of ballistic atoms and of thermalized, isotropically directed, sputtered atoms. A simple general formula is deduced and experimentally validated. Further details can be found in the article by Rafael Alvarez et. al. on page 571 .