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On the Deposition Rates of Magnetron Sputtered Thin Films at Oblique Angles
Author(s) -
Alvarez Rafael,
GarciaMartin Jose M.,
LopezSantos Maria C.,
Rico Victor,
Ferrer Francisco J.,
Cotrino Jose,
GonzalezElipe Agustin R.,
Palmero Alberto
Publication year - 2014
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201300201
Subject(s) - sputter deposition , deposition (geology) , materials science , thin film , oblique case , cavity magnetron , tilt (camera) , substrate (aquarium) , thermalisation , sputtering , plasma , optics , analytical chemistry (journal) , chemistry , atomic physics , nanotechnology , geometry , physics , geology , nuclear physics , paleontology , linguistics , philosophy , mathematics , oceanography , chromatography , sediment
We describe here the deposition of thin films using magnetron sputtering at oblique angles. General relations between the deposition rates of the films and experimental parameters, such as gas pressure or substrate tilt angles, are deduced and experimentally tested. The model also permits the direct determination of the thermalization mean free path of the sputtered particles in the plasma gas, a key parameter defining the balance between ballistic and diffusive flows in the deposition reactor. The good agreement between experimental and calculated results supports the validity of our description, which becomes a useful tool to explain the main features of the magnetron sputtering deposition of thin films at oblique angles.

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