Premium
Plasma Process. Polym. 11–12/2012
Author(s) -
Thomas Michael,
Borris Jochen,
Dohse Antje,
Eichler Marko,
Hinze Alena,
Lachmann Kristina,
Nagel Krees,
Klages ClausPeter
Publication year - 2012
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201290031
Subject(s) - wafer , cover (algebra) , materials science , plasma , atmospheric pressure plasma , atmospheric pressure , process (computing) , composite material , nanotechnology , mechanical engineering , engineering , computer science , meteorology , physics , nuclear physics , operating system
Cover: Local plasma treatment at atmospheric pressure of a 100 mm diameter silicon wafer carrying a wet‐chemically etched topography with a height difference of 50 μm between recessed and elevated areas. Further details can be found in the article by Thomas et. al. on page 1086 .