Plasma Process. Polym. 11–12/2012 | Zendy

Thomas Michael | Zendy; Borris Jochen | Zendy; Dohse Antje | Zendy; Eichler Marko | Zendy; Hinze Alena | Zendy; Lachmann Kristina | Zendy; Nagel Krees | Zendy; Klages ClausPeter | Zendy

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Plasma Process. Polym. 11–12/2012

Author(s) -

Thomas Michael,

Borris Jochen,

Dohse Antje,

Eichler Marko,

Hinze Alena,

Lachmann Kristina,

Nagel Krees,

Klages ClausPeter

Publication year - 2012

Publication title -

plasma processes and polymers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.644

H-Index - 74

eISSN - 1612-8869

pISSN - 1612-8850

DOI - 10.1002/ppap.201290031

Subject(s) - wafer , cover (algebra) , materials science , plasma , atmospheric pressure plasma , atmospheric pressure , process (computing) , composite material , nanotechnology , mechanical engineering , engineering , computer science , meteorology , physics , nuclear physics , operating system

Cover: Local plasma treatment at atmospheric pressure of a 100 mm diameter silicon wafer carrying a wet‐chemically etched topography with a height difference of 50 μm between recessed and elevated areas. Further details can be found in the article by Thomas et. al. on page 1086 .

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