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Control of Wettability of Plasma Polymers by Application of Ti Nano‐Clusters
Author(s) -
Kylián Ondřej,
Polonskyi Oleksandr,
Kratochvíl Jiří,
Artemenko Anna,
Choukourov Andrei,
Drábik Martin,
Solař Pavel,
Slavínská Danka,
Biederman Hynek
Publication year - 2012
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201100113
Subject(s) - wetting , materials science , polymer , nano , substrate (aquarium) , surface roughness , cluster (spacecraft) , surface finish , deposition (geology) , chemical engineering , plasma , thin film , polymer substrate , nanotechnology , contact angle , layer (electronics) , composite material , computer science , paleontology , oceanography , physics , quantum mechanics , sediment , engineering , programming language , geology , biology
Two‐step process that allows controlling independently roughness and chemical composition of plasma polymers, i.e., two parameters determining the wettability of such materials, is presented. In the first step a film composed of Ti nano‐clusters is deposited on a smooth substrate. Nano‐cluster films of different roughness can be obtained depending on deposition time. In the second step the nano‐cluster films are overlaid by a thin layer of plasma polymer having the desired chemical structure. This approach allows the tuning of wettability of the deposited films to as much as 50% of the wettability of the films having the same chemical structure but deposited on a smooth substrate.