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Plasma Process. Polym. 6/2010
Author(s) -
Costacurta Stefano,
Malfatti Luca,
Patelli Alessandro,
Falcaro Paolo,
Amenitsch Heinz,
Marmiroli Benedetta,
Grenci Gianluca,
Piccinini Massimo,
Innocenzi Plinio
Publication year - 2010
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201090010
Subject(s) - lithography , plasma enhanced chemical vapor deposition , materials science , plasma , cover (algebra) , process (computing) , nanotechnology , chemical engineering , composite material , thin film , polymer chemistry , optoelectronics , computer science , mechanical engineering , engineering , physics , operating system , quantum mechanics
Front Cover: Silica thick films deposited by PECVD have been patterned using deep X‐ray lithography in a process allowing fast writing of the films. This patterning technique is based on the selective removal of the organic species induced by X‐rays and local densification of the exposed regions. Further details can be found in the article by S. Costacurta, L. Malfatti, A. Patelli, P. Falcaro, H. Amenitsch, B. Marmiroli, G. Grenci, M. Piccinini, and P. Innocenzi* on page 459 .