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Mechanical Properties of Plasma‐Polymerized Tetravinylsilane Films
Author(s) -
Cech Vladimir,
Hosein HazelAnn,
Lasota Tomas,
Drzal Lawrence T.
Publication year - 2011
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.201000076
Subject(s) - nanoindentation , materials science , composite material , elastic modulus , stiffness , modulus , plasma enhanced chemical vapor deposition , plasma polymerization , thin film , polymerization , nanotechnology , polymer
Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma‐polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Young's modulus and hardness as a function of the indenter displacement (5–500 nm) were investigated for films of 1‐µm thickness. The Young's modulus (hardness) was observed to increase from 8.3 (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic–plastic material.