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Particle‐in‐Cell/Monte Carlo Collisions Model for the Reactive Sputter Deposition of Nitride Layers
Author(s) -
Bultinck Evi,
Mahieu Stijn,
Depla Diederik,
Bogaerts Annemie
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200931904
Subject(s) - sputtering , tin , titanium nitride , monte carlo method , cathode , materials science , deposition (geology) , sputter deposition , nitride , particle (ecology) , substrate (aquarium) , analytical chemistry (journal) , ion plating , physical vapor deposition , thin film , atomic physics , chemistry , nanotechnology , layer (electronics) , metallurgy , physics , chromatography , paleontology , statistics , mathematics , oceanography , sediment , geology , biology
A 2d3v Particle‐in‐cell/Monte Carlo collisions (PIC/MCC) model was constructed for an Ar/N 2 reactive gas mixture in a magnetron discharge. A titanium target was used, in order to study the sputter deposition of a TiN x thin film. Cathode currents and voltages were calculated self‐consistently and compared with experiments. Also, ion fluxes to the cathode were calculated, which cause sputtering of the target. The sputtered atom fluxes from the target, and to the substrate were calculated, in order to visualize the deposition of the TiN x film.