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Silicon Oxide Barrier Coatings Deposited on Polymer Materials for Applications in Food Packaging Industry
Author(s) -
Schneider Joachim,
Akbar Muhammad Iqbal,
Dutroncy Jerôme,
Kiesler Dennis,
Leins Martina,
Schulz Andreas,
Walker Matthias,
Schumacher Uwe,
Stroth Ulrich
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200931702
Subject(s) - materials science , polymer , polypropylene , silicon oxide , deposition (geology) , layer (electronics) , silicon , oxide , composite material , plasma , bar (unit) , chemical engineering , microwave , nanotechnology , optoelectronics , metallurgy , silicon nitride , physics , quantum mechanics , meteorology , paleontology , sediment , engineering , biology
Deposition of SiO x layers by low‐pressure microwave plasmas is an excellent means to add missing barrier functionalities to cheap and material‐saving homo‐polymeric materials that will increasingly replace expensive multi‐layer polymer food packaging. SiO x coatings were deposited in an ECR plasma process on polyethyleneterephthalate (PET) foils using two different precursors, HMDSO and HMDSN. O 2 transition rates of less than 1 cm 3 (m −2 ·24 h −1 ·bar −1 ) were obtained for the best performing SiO x coatings deposited from O 2 /HMDSN gas mixtures. First ECR plasma deposition tests on polypropylene (PP) trays show the high barrier potential of SiO x coatings even on three‐dimensional polymer food packaging.
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