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Recent Advances in the Atmospheric Pressure PE‐CVD of Fluorocarbon Films: Influence of Air and Water Vapour Impurities
Author(s) -
Fanelli Fiorenza,
Di Renzo Giovanni,
Fracassi Francesco,
d'Agostino Riccardo
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200931107
Subject(s) - fluorocarbon , impurity , water vapor , analytical chemistry (journal) , deposition (geology) , argon , dielectric barrier discharge , materials science , gas phase , chemical vapor deposition , atmospheric pressure , x ray photoelectron spectroscopy , dielectric , chemistry , chemical engineering , environmental chemistry , nanotechnology , composite material , organic chemistry , meteorology , paleontology , optoelectronics , sediment , engineering , biology , physics
The influence of air and water vapour on the deposition process of fluoropolymers in argon‐hexafluoropropene (Ar‐C 3 F 6 ) filamentary dielectric barrier discharges was investigated by adding known concentrations of these contaminants to the feed gas. The obtained results show that Ar‐C 3 F 6 DBDs allow in depositing thin films with a XPS F/C ratio as high as 1.7. Under the experimental conditions investigated, contaminant addition slightly affects the F/C ratio of the coatings, and does not cause appreciable O‐ and N‐uptake, but induces a decrease of the deposition rate. Preliminary results from the OES investigation of the gas phase and the GC‐MS analysis of the gas effluent are also reported.