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Radial‐Profile Control of Cylindrical Plasma Source With Multiple Low‐Inductance Antenna Units
Author(s) -
Takenaka Kosuke,
Setsuhara Yuichi,
Nishisaka Kazuaki,
Ebe Akinori
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200930609
Subject(s) - wafer , plasma , materials science , inductance , saturation current , antenna (radio) , optoelectronics , electrical engineering , voltage , physics , engineering , quantum mechanics
Radial‐profile control of cylindrical plasma source with 500 mm in diameter has been carried out using multiple low‐inductance antenna (LIA) units. Measurements of ion saturation current in the cylindrical chamber demonstrated an excellent control capability of radial distribution by adjusting the power‐deposition profile. The non‐uniformity of radial distributions was improved from 8.3% to 5.4% with the plasma control technologies. The results indicate that the plasma control technologies with multiple LIA units are quite attractive as a plasma source for large‐area wafer processes over 450 mm in diameter, which inherently require excellent profile control capabilities.