Premium
Improvement of the Adhesion of a Galvanic Metallization of Polymers by Surface Functionalization Using Dielectric Barrier Discharges at Atmospheric Pressure
Author(s) -
Borris Jochen,
Dohse Antje,
Hinze Alena,
Thomas Michael,
Klages ClausPeter,
Möbius Andreas,
Elbick Danica,
Weidlich ErnstRudolf
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200930606
Subject(s) - dielectric barrier discharge , surface modification , x ray photoelectron spectroscopy , atmospheric pressure , materials science , polymer , galvanic cell , polyimide , palladium , dielectric , copper , atmospheric pressure plasma , adhesion , chemical engineering , adhesive , analytical chemistry (journal) , polymer chemistry , plasma , composite material , chemistry , metallurgy , organic chemistry , layer (electronics) , optoelectronics , oceanography , physics , quantum mechanics , engineering , geology , catalysis
An environmentally friendly plasma amination process for the activation of polymers prior to electroless metallization using dielectric barrier discharges (DBD) at atmospheric pressure was investigated. One focus of the work was on the correlation between plasma parameters and palladium coverage on the polymer on the one hand and the palladium coverage and adhesion of a galvanic copper metallization on the other hand. Using XPS spectroscopy it was found that a DBD treatment of polyimide (PI) films with mixtures of N 2 and H 2 leads to considerably higher Pd surface concentrations than on untreated reference samples or foils treated in air‐DBD. The Pd coverages achieved result in peel strengths of a copper metallization of up to 1.4 N · mm −1 .