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Plasma Polymerization of Acrylic Acid Revisited
Author(s) -
Hegemann Dirk,
Körner Enrico,
Guimond Sébastien
Publication year - 2009
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200800089
Subject(s) - polymerization , acrylic acid , plasma polymerization , plasma , etching (microfabrication) , range (aeronautics) , activation energy , yield (engineering) , materials science , deposition (geology) , polymer chemistry , chemistry , analytical chemistry (journal) , physics , nanotechnology , polymer , composite material , monomer , organic chemistry , nuclear physics , paleontology , layer (electronics) , sediment , biology
To perform a systematic study over a broad parameter range of acrylic acid discharges, we varied the energy input W / F over a wide range. Five different regimes could be identified (from low to high energy input): regime I, where oligomerization takes place; regime II, the radical‐dominated plasma polymerization of acrylic acid; regime III, a transition regime showing etching/oxidation effects; regime IV, where the plasma polymerization resembles the one observed for CO 2 /C 2 H 4 discharges; and regime V, where etching effects yield a reduction in deposition rate. These results show that the polymerization mechanism can be described as a function of the energy input W / F . Specifically, a parameter range where acrylic acid can be replaced by CO 2 /C 2 H 4 discharges has been identified.