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VmeCN Based Nanoscale Multilayer PVD Coatings Deposited by the Combined High Power Impulse Magnetron Sputtering/Unbalanced Magnetron Sputtering Technology
Author(s) -
Hovsepian Papken Eh.,
Ehiasarian Arutiun P.,
Deeming Anthony,
Schimpf Christian
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200732201
Subject(s) - high power impulse magnetron sputtering , materials science , sputter deposition , physical vapor deposition , sputtering , coating , metallurgy , cavity magnetron , alloy , composite material , thin film , nanotechnology
Abstract TiAlCN/VCN has been deposited by the combined high power impulse magnetron sputtering/unbalanced magnetron sputtering (HIPIMS/UBM) technology using a Hauzer HTC 1000‐4 PVD system. V + ion flux has been generated by HIPIMS discharge to sputter‐clean the substrates prior to the coating deposition. The sputtering was carried out in a mixed CH 4 , N 2 and Ar atmosphere. Coatings phase and nanoscale structure were characterised using a variety of surface analysis techniques. In dry milling of Al 7010‐T 7651 alloy, a TiAlCN/VCN nanoscale multilayer PVD coating outperformed state‐of‐the‐art diamond‐like carbon (DLC, Cr/WC/a‐CH) coating by a factor of four. In drilling Al‐alloy enforced MMC materials, cemented carbide drills coated with TiAlCN/VCN produced 130 holes compared to one to two holes with uncoated drills.