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RF Magnetron Sputtering of Poly(propylene) in a Mixture of Argon and Nitrogen
Author(s) -
Hanus Jan,
Kousal Jaroslav,
Choukourov Andrei,
Biederman Hynek,
Slavinska Danka
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200731910
Subject(s) - argon , nitrogen , x ray photoelectron spectroscopy , analytical chemistry (journal) , deposition (geology) , materials science , sputter deposition , sputtering , oxygen , cavity magnetron , contact angle , fourier transform infrared spectroscopy , polymer , chemical engineering , chemistry , thin film , composite material , chromatography , organic chemistry , nanotechnology , paleontology , sediment , engineering , biology
Poly(propylene) was RF sputtered in a working gas mixture of argon and nitrogen using planar magnetron. With nitrogen content in the mixture increasing from 0 to 100%, the deposition rate of plasma polymer films increased from 3 to 12 nm · min −1 , the contact angle of water on sputtered plasma polymer films decreased from 62 to 37° and, according to FTIR measurements, the presence of NH and CN groups in these films increased. According to XPS, at 0% nitrogen in the working gas mixture the films contained more than 10 at.‐% of oxygen; with increasing content of nitrogen in the gas mixture this proportion steadily decreased whereas the nitrogen content in the film increased. When RF power was increased, the deposition rate and contact angle increased. Qualitative explanation of the deposition process is proposed.