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Target Utilization Improvement by Pole Pieces Insertion in a Magnetron Sputtering Target
Author(s) -
Nouvellon Corinne,
Lefèvre Patrick,
Dauchot JeanPierre,
Papantonio Raffaele,
Hecq Michel
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200731503
Subject(s) - materials science , sputtering , ferromagnetism , nitride , sputter deposition , optoelectronics , cathode , cavity magnetron , erosion , high power impulse magnetron sputtering , metallurgy , thin film , composite material , electrical engineering , nanotechnology , condensed matter physics , engineering , physics , paleontology , layer (electronics) , biology
Magnetron sputtering is extensively used in the synthesis of many kinds of thin films: alloys, oxides and nitrides. Due to the very localized erosion, only 15–30% of the target materials can be used. In order to make the target erosion more uniform, it is proposed to put ferromagnetic pieces in the target. It becomes possible to improve magnetron performances without modifying the cathode. Copper has been chosen for this study because of its high erosion rate. Targets with and without ferromagnetic pieces have been sputtered. Different ferromagnetic piece widths and positions have been tested. Target erosion profiles and weight loss after sputtering are compared. It is demonstrated that ferromagnetic pieces inserted in the target at a judicious place, as determined by 3D magnetic field simulation, can increase target lifetime.