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Interface Effects Study in Hard–Soft Carbon Multilayered Films by AES Depth Profiling
Author(s) -
Micheli Victor,
Laidani Nadhira,
Bartali Ruben,
Gottardi Gloria,
Anderle Mariano
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200730713
Subject(s) - auger electron spectroscopy , materials science , sputtering , chemical vapor deposition , plasma enhanced chemical vapor deposition , chemical composition , thin film , surface finish , composite material , substrate (aquarium) , profiling (computer programming) , nanotechnology , chemistry , computer science , geology , nuclear physics , physics , oceanography , organic chemistry , operating system
Systems consisting of sequential layers of hard and soft carbon films were deposited on Si substrates by sputtering and plasma‐assisted chemical vapor deposition (PACVD). A full characterization of the film and of the interfaces is considered crucial to obtain a correlation between the mechanical properties and the chemical composition and architecture of the films. In this work, the Auger‐electron spectroscopy (AES) depth profiling technique was applied to study the chemical composition of the film and of the different interfaces (hard/soft layers; film/substrate). In particular, we focused on an optimization of the depth resolution parameters. A strong period–thickness effect on the film/substrate interface width was observed. Sputtering‐induced roughness was also evaluated to check its effect on the interface width and on its morphological changes.