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High Rate Deposition of Al 2 O 3 Coatings Reactively Sputter Deposited
Author(s) -
Mercs David,
Petitot Christian,
Duranteau Audrey,
Demange Valérie,
Coddet Christian
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200730606
Subject(s) - materials science , sputtering , deposition (geology) , sputter deposition , metallurgy , composite material , thin film , nanotechnology , geology , paleontology , sediment
According to its high temperature stability, low friction coefficient against metals and relatively high hardness, α ‐Al 2 O 3 is a good candidate for high performance coatings. However, Al 2 O 3 is brittle which limits its application as a protective coating for mechanical applications. Moreover, reactive sputtering of alumina is often associated with low deposition rates. In this study, two experimental devices were used to deposit Al 2 O 3 coatings with high deposition rates. High bias voltage, as well as an increase in the aluminium target temperature showed an increase in the fraction of crystalline phase into the films. Al 2 O 3 coatings were deposited on WC samples to perform tribological tests.