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High Rate Deposition of Magnetic Material by Gas Flow Sputtering
Author(s) -
Bandorf Ralf,
Bloche Andre,
Ortner Kai,
Lüthje Holger,
Jung Thomas
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200730504
Subject(s) - coercivity , materials science , sputtering , remanence , coating , volumetric flow rate , thin film , analytical chemistry (journal) , deposition (geology) , sputter deposition , substrate (aquarium) , permeability (electromagnetism) , stoichiometry , composite material , magnetization , magnetic field , nanotechnology , chemistry , condensed matter physics , paleontology , physics , sediment , geology , membrane , oceanography , biology , biochemistry , chromatography , quantum mechanics , organic chemistry
For different applications like thin film sensors or microactuators soft and hard magnetic films are required to create and guide the magnetic flux. In many cases, the required thickness of the coatings is well above 10 µm. For the preparation of coatings various techniques are used. In this paper we will present gas flow sputtering as a high potential method for high rate preparation of soft and hard magnetic coatings. The preparation conditions were varied and the influence of gas flow, working pressure, deposition temperature and substrate bias were investigated. In the field of soft magnetic films NiFe (81/19) was investigated. After optimization of the deposition parameters, growth rates exceeding 50 µm · h −1 were realized. The permeability µ r was also tailored to higher values. Actual results showed µ r values higher than 240 for a 10 µm thick coating. For films sputtered at 300 °C the coercitivity H c of was below 340 A·m −1 . As a hard magnetic material Co x Sm y was investigated. Since the stoichiometry of the target was Co:Sm = 80:20 at.‐%, CoSm coatings with mainly Co 5 Sm were prepared. The angular dependence of the coercivity H c and remanence B r were investigated. The resulting coercitivity of the films was up to 1 220 kA·m −1 even with a high content of residual oxygen in the films. Deposition rates of 85 µm·h −1 could be realized.