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Factors Affecting Microhardness of Ti/TiN Multilayer Films Deposited by Pulsed Bias Arc Ion Plating
Author(s) -
Lin Guoqiang,
Zhao Yanhui,
Dong Chuang,
Wen Lishi
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200730502
Subject(s) - materials science , indentation hardness , tin , ion plating , grain size , duty cycle , biasing , pulsed dc , metallurgy , arc (geometry) , ion , composite material , analytical chemistry (journal) , thin film , microstructure , coating , electrical engineering , nanotechnology , chemistry , voltage , sputtering , sputter deposition , engineering , organic chemistry , geometry , mathematics , chromatography
Ti/TiN multilayer films were deposited on high‐speed‐steel (HSS) substrates using pulsed‐bias arc ion plating. Orthogonal experiments were used to analyze factors affecting microhardness of the films. The results show that of all the pulsed bias related parameters including pulsed bias magnitude, duty ratio, frequency, and film geometry parameters including modulation period, TiN/Ti thickness ratio, and grain size of TiN, the pulsed bias magnitude is the major factor affecting the microhardness. The maximum microhardness of 34.1 GPa was obtained with pulsed bias magnitude 900 V, duty ratio 50%, frequency 30 kHz, and modulation period 84 nm.