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Low‐Creep Metallic Thin Films and Reflective Coatings for Optical Microsystems
Author(s) -
Schmidt Jan U.,
Knobbe Jens,
Gehner Andreas
Publication year - 2007
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200730401
Subject(s) - materials science , creep , microsystem , actuator , optoelectronics , coating , deflection (physics) , microelectromechanical systems , cmos , current mirror , planar , plasma enhanced chemical vapor deposition , voltage , chemical vapor deposition , composite material , nanotechnology , optics , electrical engineering , transistor , physics , computer graphics (images) , engineering , computer science
Abstract The large‐scale integration of analog operable MEMS micromirrors onto active CMOS address circuitry involves several challenges. Mirror actuators must be fabricated using CMOS compatible technology, exhibit highly reflecting planar optical surfaces, and stable analog deflection‐voltage characteristics not compromised by drift or creep effects. CMOS integration imposes strict limits depending on the range of available materials and the restricted temperature budget. Highly elastic materials such as single‐crystalline Si or poly‐SiGe have been integrated by layer transfer bonding or PECVD deposition, respectively. In this paper, a novel approach, i.e., the low‐temperature monolithic integration of creep‐resistant all‐sputtered glassy TiAl mirror actuators with Al reflective coating is presented.