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Cover Picture: Plasma Process. Polym. 2/2006
Author(s) -
Supiot Philippe,
Vivien Céline,
Granier Agnès,
Bousquet Angélique,
Mackova Anna,
Escaich David,
Clergereaux Richard,
Raynaud Patrice,
Stryhal Zdenek,
Pavlik Jaroslav
Publication year - 2006
Publication title -
plasma processes and polymers
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.644
H-Index - 74
eISSN - 1612-8869
pISSN - 1612-8850
DOI - 10.1002/ppap.200690002
Subject(s) - cover (algebra) , materials science , scale (ratio) , composite material , physics , engineering , mechanical engineering , quantum mechanics
Cover: AFM scans (5µm × 5µm) of 500 nm thick films as deposited on Si from processes a) RFICP (full vertical scale: 12.6 nm), b) MIRA (full vertical scale: 44.9 nm), and c) DECRP (full vertical scale: 27.7 nm). Further details can be found in the Full Paper by P. Supiot, * C. Vivien, A. Granier, A. Bousquet, A. Mackova, D. Escaich, R. Clergereaux, P. Raynaud, Z. Stryhal, and J. Pavlik on page 100.