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Toughening rigid thermoset films via molecular enforced integration of covalent crosslinking and multiple supramolecular interactions
Author(s) -
Wang Cheng,
Zhang Shuai,
Li Shanggeng,
Zhang Longfei,
Zhou Yawen,
Ma Jiajun,
Zhang Lin
Publication year - 2021
Publication title -
journal of polymer science
Language(s) - English
Resource type - Journals
eISSN - 2642-4169
pISSN - 2642-4150
DOI - 10.1002/pol.20210134
Subject(s) - thermosetting polymer , supramolecular chemistry , covalent bond , epoxy , toughening , materials science , triethylenetetramine , stacking , hydrogen bond , polymer chemistry , ultimate tensile strength , composite material , chemistry , molecule , organic chemistry , toughness
Rigid thermosets show great potential application value in several fields; however, enhancing their extensibility without losing the required mechanical strength is always a huge challenge. In this work, a new class of rigid thermosets, poly(triethylenetetramine bisphenol A epoxy phenylimidazole)s, with both multiple supramolecular interactions, including “face–face” π–π stacking, “point–point” hydrogen bond, and ion‐pair electrostatic interaction, and covalent crosslinks is developed by introducing the special functional group 2‐phenylimidazole into the crosslinked thermoset. Owing to the synergistic effect of the strong covalent crosslinks and the multiple supramolecular interactions, synchronously improved tensile strengths and elongation at break have been successfully obtained with these rigid thermosets.