Premium
How broad band (from radio frequency to microwaves) dielectric parameters describe synthetic chemical reactions
Author(s) -
Meyer Olivier,
Delmotte Michel,
Lacroix JeanChristophe,
Weil Raphaël,
Loupy André,
Maurel François,
FourrierLamer Arlette
Publication year - 2008
Publication title -
journal of physical organic chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.325
H-Index - 66
eISSN - 1099-1395
pISSN - 0894-3230
DOI - 10.1002/poc.1338
Subject(s) - chemistry , dielectric , microwave , dipole , ionic bonding , low frequency , frequency band , relaxation (psychology) , conductivity , chemical reaction , chemical physics , ion , organic chemistry , optoelectronics , materials science , physics , bandwidth (computing) , social psychology , psychology , computer science , computer network , quantum mechanics , astronomy
Large differences in the dielectric responses of isolated molecules and associated reactive mixtures are observed over a wide frequency spectrum ranging from low to microwave frequencies. We present the results obtained for the curing (cross‐linking) of a resin mixed with a hardener. Electrical dipoles contribute to orientation polarization whose responses lie in the 1 kHz to over 1 GHz frequency range, which is predominantly higher than the 0.1 Hz–10 kHz range in which ionic conductivity is observed. It is the relaxation frequency of the reactive mixture that will be considered as the reaction marker. We also describe the results obtained with the saponification of an ester in the presence of a catalyst, with the reactive mixture containing – as in the previous case – electric dipoles and ions, but with responses superimposed in the 1 MHz–10 GHz frequency band. In this case, and for simplification reasons, the low frequency band ionic conductivity is the reaction marker. The aim of this paper is to translate synthetic chemical reactions into electronic terms, in order to allow electronics engineers to understand the interaction between electromagnetic waves and materials. Copyright © 2008 John Wiley & Sons, Ltd.