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Mechanisms of adhesion degradation at the photovoltiac module's cell metallization‐encapsulant interface
Author(s) -
Bosco Nick,
Moffitt Stephanie,
Schelhas Laura T.
Publication year - 2019
Publication title -
progress in photovoltaics: research and applications
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.286
H-Index - 131
eISSN - 1099-159X
pISSN - 1062-7995
DOI - 10.1002/pip.3106
Subject(s) - materials science , ionic bonding , degradation (telecommunications) , oxide , silane , dissociation (chemistry) , adhesion , composite material , humidity , ionic conductivity , biasing , ion , chemical engineering , electrolyte , voltage , chemistry , electronic engineering , metallurgy , electrical engineering , physics , organic chemistry , electrode , engineering , thermodynamics
Adhesion measurements and chemical characterization of the encapsulant/silver metallization interface of a photovoltaic (PV) module through temperature, humidity, and voltage bias exposures were conducted. Results demonstrate two independent degradation mechanisms: (a) with voltage bias, the ionic conduction of Na + ions through the encapsulant results in the formation of sodium silicate at the silver metallization surface, thereby weakening that interface and (b) with moisture ingress, dissociation of the silane bonding to silver in the silver oxide similarly weakens this interface resulting in significantly lower debond energies.