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In‐situ self reinforced polyimide for film materials
Author(s) -
Fan Haojun,
Gu Yi,
Xie Meili
Publication year - 2001
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.781
Subject(s) - mesogen , polyimide , materials science , crystallinity , thermal stability , ultimate tensile strength , epoxy , polymer , polymer chemistry , side chain , solubility , chemical engineering , composite material , organic chemistry , liquid crystalline , chemistry , layer (electronics) , engineering
A novel polyimide (PI) with mesogenic units was synthesized by the reaction between the pendent hydroxyl group of PI and the epoxy group of a liquid crystalline (LC) compound in the presence of N,N ‐dimethylaniline at 120–130 °C. As a result, a novel in‐situ self‐reinforced PI film materials was obtained. The macromolecular reaction between the hydroxyl group and epoxy group was investigated by a model reaction. The properties of PI were studied by WAXD, DSC and polarized optical microscopy, and the results indicate that the polyimides with mesogenic units exhibit a smectic phase, the mesogenic units level influencing the side‐chain crystallinity, and also the thermal and mechanical properties of the polymers; the enhanced PI films possess good solubility, higher thermal stability, higher tensile strength and modulus. © 2001 Society of Chemical Industry
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