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Dielectric monitoring of curing of liquid oligomer‐modified epoxy matrices
Author(s) -
Kortaberria G,
Arruti P,
Mondragon I
Publication year - 2001
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.722
Subject(s) - epoxy , curing (chemistry) , materials science , diglycidyl ether , oligomer , dielectric , bisphenol a , polymerization , composite material , vitrification , glass transition , polymer chemistry , polymer , chemical engineering , medicine , optoelectronics , andrology , engineering
Dielectric measurements were performed in ‘real‐time’ at several temperatures to follow polymerization reactions on blends of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin with 4, 4′‐diaminodiphenylmethane (DDM) hardener and different amounts of polyoxypropylenetriamine (POPTA) oligomer. These systems exhibit phase separation induced by molar mass increasing through curing of the resin. Monitoring of phase separation and vitrification (related to the α‐relaxation) was performed by this technique. The results are compared with those for the unmodified resin–hardener mixture. The change of the main α‐relaxation with cure time, cure temperature, and amount of modifier was measured for the mixtures. This change of the main relaxation through curing in the frequency domain was indicative of the cure reaction advancement, because of its dependence on the viscosity of the medium. The change of the ionic conductivity during curing was also analysed, showing its dependence upon cure temperature. © 2001 Society of Chemical Industry