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Incorporating bis‐benzimidazole into polyimide chains for effectively improving thermal resistance and dimensional stability
Author(s) -
Lian Meng,
Zheng Feng,
Wu Qi,
Lu Xuemin,
Lu Qinghua
Publication year - 2020
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.5922
Subject(s) - benzimidazole , polyimide , thermal stability , glass transition , materials science , thermal expansion , hydrogen bond , atmospheric temperature range , temperature coefficient , rigidity (electromagnetism) , polymer chemistry , chemical engineering , nanotechnology , composite material , polymer , organic chemistry , chemistry , molecule , thermodynamics , layer (electronics) , engineering , physics
Heteroaromatic 6,6′‐bis[2‐(4‐aminobenzene)benzimidazole] and its corresponding copolyimides were synthesized to produce high temperature resistant polyimides (PIs). Due to the rigidity and aromaticity of heterocyclic bis‐benzimidazole, and the increased hydrogen bonding interactions, these PIs were found to have a high glass transition temperature ( T g ) over 457 °C, which also guarantees a better dimensional stability with a coefficient of thermal expansion (CTE) lower than 10 ppm K −1 in a wider temperature range of 50–400 °C. In addition, the PIs exhibit excellent thermal stability (5% weight loss temperature higher than 559 °C) along with outstanding mechanical properties. This study demonstrates the viability to access PIs with ultrahigh T g and low CTE in a wider range of temperature by the incorporation of bis‐benzimidazole moieties. © 2019 Society of Chemical Industry