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Conductive poly(3,4‐ethylenedioxythiophene): poly(styrene sulfonate) polymer glue as an ohmic and rectifying electrical contact for H‐terminated n‐Si and p‐Si wafers
Author(s) -
Cohen Daniel,
Bostian Micah E,
Nguyen Li,
Walter Michael G
Publication year - 2018
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.5561
Subject(s) - materials science , pedot:pss , ohmic contact , silicon , conductive polymer , electrical conductor , wafer , styrene , composite material , polymer , polymer chemistry , optoelectronics , copolymer , layer (electronics)
An organic conductive glue based on a blend of poly(3,4‐ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) and d ‐sorbitol was examined for laminating conductors to crystalline silicon. The PEDOT:PSS glue functions as a high‐work‐function solution processable conductor and exhibits an ohmic contact on p‐type silicon and a rectifying contact on n‐type silicon. Under illumination, the n‐Si/PEDOT:PSS: d ‐sorbitol junctions exhibit current–voltage characteristics suggesting minority carrier trap states, leading to charge recombination at the silicon/polymer interface. Conductive glue for laminating to crystalline silicon is desirable for making electrical contacts to flexible materials such as molecular semiconductors, graphene or transparent conductive oxides. These materials could eliminate the need for metal contacts to the front face of silicon solar cells. Conductive glue could prove especially useful for laminating to textured silicon or novel micro‐ or nanostructured silicon materials. © 2018 Society of Chemical Industry