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Encapsulation of imidazole with synthesized copolymers for latent curing of epoxy resin
Author(s) -
Shin Young Jae,
Shin Min Jae,
Shin Jae Sup
Publication year - 2017
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.5317
Subject(s) - epoxy , copolymer , materials science , imidazole , adhesive , curing (chemistry) , methacrylic acid , composite material , chemical engineering , polymer chemistry , polymer , organic chemistry , chemistry , layer (electronics) , engineering
Abstract Anisotropic conductive film ( ACF ) is an essential component in the manufacture of liquid crystal displays, and an imidazole–epoxy resin system that exhibits a latent behavior is generally used as an adhesive in the ACF . In this study, a new copolymer was synthesized using methacrylic acid and dodecyl methacrylate, and this copolymer was used to encapsulate an imidazole curing agent to endow the ACF with latent behavior. A spray‐drying method was used in the encapsulation process, and this encapsulated imidazole was mixed with epoxy resin to form an imidazole–epoxy resin system. A comparison with our previous results showed that a smaller amount of polymeric material could be used in the encapsulating process, and a superior latent behavior could be obtained. © 2016 Society of Chemical Industry