Encapsulation of imidazole with synthesized copolymers for latent curing of epoxy resin | Zendy

Shin Young Jae | Zendy; Shin Min Jae | Zendy; Shin Jae Sup | Zendy

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Encapsulation of imidazole with synthesized copolymers for latent curing of epoxy resin

Author(s) -

Shin Young Jae,

Shin Min Jae,

Shin Jae Sup

Publication year - 2017

Publication title -

polymer international

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.592

H-Index - 105

eISSN - 1097-0126

pISSN - 0959-8103

DOI - 10.1002/pi.5317

Subject(s) - epoxy , copolymer , materials science , imidazole , adhesive , curing (chemistry) , methacrylic acid , composite material , chemical engineering , polymer chemistry , polymer , organic chemistry , chemistry , layer (electronics) , engineering

Anisotropic conductive film ( ACF ) is an essential component in the manufacture of liquid crystal displays, and an imidazole–epoxy resin system that exhibits a latent behavior is generally used as an adhesive in the ACF . In this study, a new copolymer was synthesized using methacrylic acid and dodecyl methacrylate, and this copolymer was used to encapsulate an imidazole curing agent to endow the ACF with latent behavior. A spray‐drying method was used in the encapsulation process, and this encapsulated imidazole was mixed with epoxy resin to form an imidazole–epoxy resin system. A comparison with our previous results showed that a smaller amount of polymeric material could be used in the encapsulating process, and a superior latent behavior could be obtained. © 2016 Society of Chemical Industry

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