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Solution‐processable colorless polyimides with ultralow coefficients of thermal expansion for optoelectronic applications
Author(s) -
Hasegawa Masatoshi,
Watanabe Yuhei,
Tsukuda Soichi,
Ishii Junichi
Publication year - 2016
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.5152
Subject(s) - materials science , thermal expansion , glass transition , coating , composite material , compatibility (geochemistry) , solubility , chemical engineering , polymer , organic chemistry , chemistry , engineering
The material shown in the figure achieved solution‐processability, excellent transparency, a high glass transition temperature of 329 °C, an ultralow coefficient of thermal expansion of 7.3 ppm K −1 and toughness as obtained by solution casting.