Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy | Zendy

Jiang Hao | Zendy; Wang Rumin | Zendy; Farhan Shameel | Zendy; Zhang Dandan | Zendy; Zheng Shuirong | Zendy

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Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy

Author(s) -

Jiang Hao,

Wang Rumin,

Farhan Shameel,

Zhang Dandan,

Zheng Shuirong

Publication year - 2016

Publication title -

polymer international

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.592

H-Index - 105

eISSN - 1097-0126

pISSN - 0959-8103

DOI - 10.1002/pi.5073

Subject(s) - epoxy , thermogravimetric analysis , materials science , curing (chemistry) , thermosetting polymer , differential scanning calorimetry , dynamic mechanical analysis , glass transition , thermal stability , composite material , fourier transform infrared spectroscopy , fracture toughness , polymer , chemical engineering , physics , engineering , thermodynamics

Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy A new liquid crystalline epoxy ( LCE ) has been synthesized. The effect of LCE on the thermal and mechanical properties of a cured modified TGDDM / DDS resin was investigated.

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