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Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy
Author(s) -
Jiang Hao,
Wang Rumin,
Farhan Shameel,
Zhang Dandan,
Zheng Shuirong
Publication year - 2016
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.5073
Subject(s) - epoxy , thermogravimetric analysis , materials science , curing (chemistry) , thermosetting polymer , differential scanning calorimetry , dynamic mechanical analysis , glass transition , thermal stability , composite material , fourier transform infrared spectroscopy , fracture toughness , polymer , chemical engineering , physics , engineering , thermodynamics
Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy A new liquid crystalline epoxy ( LCE ) has been synthesized. The effect of LCE on the thermal and mechanical properties of a cured modified TGDDM / DDS resin was investigated.