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Dielectric and viscoelastic studies of poly(ethyl methacrylate) containing cholesteric compounds
Author(s) -
Deshpande Dinkar D.,
Basu Chandana,
Pandya Madhav V.
Publication year - 1991
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.4990240106
Subject(s) - methacrylate , materials science , dielectric , polymer , viscoelasticity , polymer chemistry , composite material , copolymer , optoelectronics
Poly(ethyl methacrylate) (PEMA) containing small amounts of cholesteryl additives was studied by dielectric and dynamic mechanical spectroscopy. Dielectric data from pure PEMA and PEMA + additive systems were fitted to the WLF equation. Using the WLF constants obtained from the data for pure PEMA, the T o values for PEMA + additive systems were determined in order to get the best fit of the experimental points to the WLF curve. Values of tan δmax (dielectric and mechanical) for all the PEMA + additive systems shift to higher temperatures compared with that for pure PEMA. In the glassy region, the moduli of PEMA + additive systems are higher than that of pure PEMA. Viscometric studies of PEMA + additive systems indicate the presence of some interaction. FTIR spectra of the polymer + additive systems show no shift in carbonyl bond frequency. The shift of T g to higher temperatures indicates that chain motion in this region is hindered greatly by these additives and the reason for this may be the fitting or aligning of the additive molecules in the polymer matrix.