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Enhanced thermal conductivity and dimensional stability of flexible polyimide nanocomposite film by addition of functionalized graphene oxide
Author(s) -
Tseng IHsiang,
Chang JenChi,
Huang ShihLiang,
Tsai MeiHui
Publication year - 2013
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.4375
Subject(s) - polyimide , materials science , nanocomposite , graphene , thermal stability , thermal conductivity , composite material , oxide , thermal expansion , composite number , glycidyl methacrylate , substrate (aquarium) , conductivity , polymer , chemical engineering , nanotechnology , polymerization , chemistry , layer (electronics) , oceanography , geology , engineering , metallurgy
Polyimide ( PI ) nanocomposites with both enhanced thermal conductivity and dimensional stability were achieved by incorporating glycidyl methacrylate‐grafted graphene oxide (g‐ GO ) in the PI matrix. The PI /g‐ GO nanocomposites exhibited linear enhancement in thermal conductivity when the amount of incorporated g‐ GO was less than 10 wt%. With the addition of 10 wt% of g‐ GO to PI ( PI /g‐ GO ‐10), the thermal conductivity increased to 0.81 W m −1 K −1 compared to 0.13 W m −1 K −1 for pure PI . Moreover, the PI /g‐ GO ‐10 composite exhibited a low coefficient of thermal expansion ( CTE ) of 29 ppm °C −1 . The values of CTE and thermal conductivity continuously decreased and increased, respectively, as the g‐ GO content increased to 20 wt%. Combined with excellent thermal stability and high mechanical strength, the highly thermally conducting PI /g‐ GO ‐10 nanocomposite is a potential substrate material for modern flexible printed circuits requiring efficient heat transfer capability.