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Modification of epoxy–anhydride thermosets using a hyperbranched poly(ester‐amide): I. Kinetic study
Author(s) -
FernándezFrancos Xavier,
Rybak Andrzej,
Sekula Robert,
Ramis Xavier,
Serra Angels
Publication year - 2012
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.4259
Subject(s) - thermosetting polymer , epoxy , curing (chemistry) , differential scanning calorimetry , materials science , fourier transform infrared spectroscopy , kinetics , polymer chemistry , amide , chemical engineering , coating , chemical modification , composite material , organic chemistry , chemistry , physics , quantum mechanics , engineering , thermodynamics
An epoxy‐anhydride formulation used for the coating of electrical devices was modified with a commercially available hyperbranched poly(ester‐amide), Hybrane™ S2200, in order to improve the thermal degradability of the resulting thermoset and thus facilitate the recovery of substrate materials after use of the component. The curing kinetics of the unmodified and modified formulations were studied in detail with differential scanning calorimetry, Fourier transform infrared spectroscopy and rheology. The results suggest that S2200 gets incorporated into the network structure and the curing kinetics are accelerated by the presence of hydroxyl groups from S2200. Copyright © 2012 Society of Chemical Industry