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Insulating polyimide films containing n‐type perylenediimide moieties
Author(s) -
Damaceanu MarianaDana,
Rusu RaduDan,
Musteata ValentinaElena,
Bruma Maria
Publication year - 2012
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.4253
Subject(s) - polyimide , materials science , moiety , dielectric , permittivity , polymer chemistry , polymer , oxadiazole , condensation polymer , x ray photoelectron spectroscopy , dielectric loss , dielectric spectroscopy , composite material , chemical engineering , chemistry , organic chemistry , optoelectronics , electrochemistry , electrode , layer (electronics) , engineering
Oxadiazole‐containing polyperyleneimides were prepared by high‐temperature solution polycondensation reaction of an aromatic diamino‐oxadiazole with a mixture of two dianhydrides, one containing a perylene moiety and the other containing a hexafluoroisopropylidene unit. Flexible films having good mechanical properties were made therefrom. The structure of the polymer films was confirmed using X‐ray photoelectron spectroscopy. Some polymer films were subjected to measurements of electrical insulating properties. The variation of the real and imaginary parts of the dielectric permittivity with frequency and temperature was recorded. The values of the dielectric constant, dielectric loss and specific resistance were obtained at 25 °C and in the frequency domain from 1 Hz to 130 kHz. The dielectric spectroscopy data showed distinct γ and β subglass transitions for these polymers at low activation energies. Electronic conduction through a hopping mechanism in these polyimide films was determined from AC conductivity measurements. Copyright © 2012 Society of Chemical Industry