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Synthesis of rosin‐based imidoamine‐type curing agents and curing behavior with epoxy resin
Author(s) -
Wang Honghua,
Wang Haiwei,
Zhou Guangyuan
Publication year - 2011
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.2978
Subject(s) - rosin , curing (chemistry) , epoxy , materials science , thermal stability , differential scanning calorimetry , fourier transform infrared spectroscopy , thermogravimetry , polymer chemistry , bisphenol a , composite material , resin acid , organic chemistry , chemical engineering , chemistry , physics , engineering , thermodynamics
Rosin is an abundantly available natural product. The characteristic fused ring structure of rosin acids is analogous to that of some aromatic compounds in rigidity, and makes rosin and its derivatives potential substitutes for those aromatic compounds. In the study reported, the synthesis of biobased curing agents containing imide structure using rosin and the cure reaction were investigated. Rosin‐based imidoamine‐type curing agents were synthesized, and the chemical structure was confirmed using 1 H NMR, Fourier transform infrared and electrospray ionization spectroscopy. The curing behavior with diglycidyl ether of bisphenol A epoxy was studied using differential scanning calorimetry. The thermal mechanical properties and thermal stability of the cured epoxy resins were evaluated using dynamic mechanical analysis and thermogravimetry, respectively. The results indicate that the curing behavior of the rosin‐based curing agents is similar to that of curing agents with analogous structures. Cured products have good thermal stability due to the presence of the imide group and the bulky hydrogenated phenanthrene ring structure. Rosin acids have a great potential in the synthesis of epoxy curing agents as replacements for some of the current commercial aromatic or cycloaliphatic analogues. Copyright © 2010 Society of Chemical Industry