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Effect of side‐chain length of succinic anhydride on coefficient of thermal expansion behavior of epoxy resins
Author(s) -
Jin FanLong,
Han Mijeong,
Park SooJin
Publication year - 2006
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.2082
Subject(s) - epoxy , succinic anhydride , side chain , thermal expansion , epoxide , bisphenol a , materials science , polymer chemistry , chemistry , composite material , polymer , organic chemistry , catalysis
The effect of an alkenyl side‐chain of succinic anhydride (SA) on the thermal behavior and the coefficient of thermal expansion (CTE) of diglycidylether of bisphenol A (DGEBA) epoxy resins was studied. The number of carbons in the side‐chain of SA was varied from 6 to 14 and N , N ‐Dimethylbenzylamine was used as an accelerator. As a result, the reactivity of SA with epoxide groups was decreased on increasing the length of the alkenyl side‐chain of SA. The thermal stabilities of cured DGEBA/SA samples were approximately constant with varying alkenyl side‐chain of SA. Also, the CTE of the systems was increased as the length of the alkenyl side‐chain of SA increased. This could be attributed to the increased motion of the chain segments in the epoxy network structure induced by the longer alkenyl side‐chain of SA. The effect of amount anhydride, thermoplastics, and fillers on the CTE of the epoxy resins was also discussed. Copyright © 2006 Society of Chemical Industry